China makes strides in high-tech memory chips

Chinese chipmakers are making headway in producing high-bandwidth memory (HBM) crucial for artificial intelligence (AI) applications, aiming to reduce reliance on foreign suppliers, as Reuters reported on Wednesday.

This progress, though in older HBM versions, signifies a significant step for China’s chip industry as tensions with the US restrict access to advanced chipsets.

Leading DRAM manufacturer CXMT is developing HBM samples with Tongfu Microelectronics, showcasing them to potential clients. Wuhan Xinxin, another player, is constructing a factory to produce 3,000 12-inch HBM wafers monthly.

These efforts are backed by government funding as China prioritises domestic chip development. Tech giant Huawei also reportedly aims for HBM2 production by 2026 through partnerships.

However, challenges remain. The market is dominated by South Korea’s SK Hynix and Samsung, and China currently focuses on HBM2, lagging behind the latest HBM3 standard. Experts estimate China trails global leaders by a decade.

Despite these hurdles, CXMT’s collaboration with Tongfu signifies a potential leap in domestic HBM capabilities.

Patent filings indicate China’s pursuit of HBM technology began at least three years ago, with ongoing advancements in packaging and HBM3 development.